The Study of the Enhancement for Wafer Level Solder Bump Reflow Process
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 95 === A “Bump” is a connector between Chip and Substrate in Flip Chip Assembly process. It usually is produced by Evaporating, Solder Paste Printing or Solder Plating process. In Flip Chip Bonding process, there were four important factors between the Bum...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96925811837860256960 |