The Impact of Electromigration on Breakdown Behavior for Wafer-level Packaging Application
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 95 === According to the fast development of portable electronic devices, their characteristics are inclined to miniature outline and lightweight. So we need to develop good reliable package to meet the future trend. The demand of small outlines, lightweigh...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/11272615255741296364 |