Thermal Conductivity of Two Phase Composites
碩士 === 國立臺灣科技大學 === 機械工程系 === 95 === The heat dispersal and thermal expansion are issues of the paramount importance in high power integrated circuits, and other areas of electronics. The attributes existing in a composite such as a different volume fraction, grain size, contiguity or porosity, etc....
Main Authors: | Chia-ching Lin, 林佳慶 |
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Other Authors: | Shun-Tian Lin |
Format: | Others |
Language: | en_US |
Published: |
2007
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Online Access: | http://ndltd.ncl.edu.tw/handle/63621341488354344815 |
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