Thermal Conductivity of Two Phase Composites

碩士 === 國立臺灣科技大學 === 機械工程系 === 95 === The heat dispersal and thermal expansion are issues of the paramount importance in high power integrated circuits, and other areas of electronics. The attributes existing in a composite such as a different volume fraction, grain size, contiguity or porosity, etc....

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Bibliographic Details
Main Authors: Chia-ching Lin, 林佳慶
Other Authors: Shun-Tian Lin
Format: Others
Language:en_US
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/63621341488354344815