Accurate Warp Prediction of Electronic Packaging During a Sequential Manufacturing Process by Measurement and Simulation Analysis
博士 === 國立臺灣大學 === 應用力學研究所 === 95 === A mechanical model followed a sequential manufacturing process was considered in order to simulate the warpage during a sequential steps of the assembly of a plastic encapsulated ball grid arrays (BGA) package, such as die attachment, encapsulation, and solder re...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96681270489269848115 |