CMP Diamond Conditioner Dressing Characteristics of Polyurethane Pad
博士 === 國立臺灣大學 === 機械工程學研究所 === 95 === The wafer performance is often determined by the texture of the pad surface which is controlled by a diamond pad conditioner in the CMP process. In the thesis, the fundamental characteristics of dressing action on the polyurethane pad are investigated first via...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/37242272770187493119 |