A Novel Electromagnetic Bandgap (EBG) Power Plane for High-Speed System on Package Design

• Main Authors: Tzu-Wei Han, 韓子偉
• Other Authors: 吳宗霖
• Format: Others
• Language: en_US
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/13874518941618700858

碩士 === 國立臺灣大學 === 電信工程學研究所 === 95 === Abstract Transient current surges resulted from the simultaneous switching of output buffers in the high-speed digital circuits can induce significant ground bounce noise (GBN) on the chip, package, and printed circuit board (PCB). The GBN not only causes the signal integrity problems but also deteriorate the EMI in the high-speed digital circuits. With the design trends of digital circuits toward higher speed, lower voltage level, and smaller package size, the impact of GBN has become one of the most important issues that determine the performance of electronic systems. In this thesis we propose a novel power distribution structure with stopband enhancement by introducing the concept of “Artificial substrate”. Based on the conventional coplanar EBG power plane, it is fabricated by periodically embedding materials with different dielectric constant between the power and ground plane to perturb the effective dielectric constant for different resonance modes. It is found that with proper design of the positions and dielectric constant of the embedded materials, the stopband bandwidth can be enhanced by reducing the frequency of the first mode and increasing the frequency of the second one at the same time. This idea is verified by simulation and measurement both in time- and frequency-domain. Over 60% bandwidth enhancement for the SSN suppression is achieved in this work.