A Novel Electromagnetic Bandgap (EBG) Power Plane for High-Speed System on Package Design
碩士 === 國立臺灣大學 === 電信工程學研究所 === 95 === Abstract Transient current surges resulted from the simultaneous switching of output buffers in the high-speed digital circuits can induce significant ground bounce noise (GBN) on the chip, package, and printed circuit board (PCB). The GBN not only causes the s...
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| Format: | Others |
| Language: | en_US |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13874518941618700858 |