The Effects of Geometric Parameters Variation on Lead-Free Flip-Chip Package under Temperature Cycling Test
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 95 === Thermal fatigue failure, due to the fracture of solder bumps which was cased by the coefficient of thermal expansion mismatch deformation, is frequently encountered in flip-chip package. Therefore, this thesis attempts to study the effects of geometric param...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/8ny58s |