Study of underfill material characteristics and structural stress analysis during the assembly processing and under temperature cycling loading for high I/Os lead-free flip chip on build-up substrate packaging
碩士 === 國立屏東科技大學 === 材料工程所 === 95 === The properties of the underfill material are very important for the flip chip on build-up substrate package. The interfacial shear strengths of underfill/chip and underfill/substrate are also important as one of the guidelines for evaluating the reliability of th...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/72823928849934851518 |