The Study of LED Package and Estimation of Internal Quantum Efficiency
碩士 === 國立中央大學 === 光電科學研究所 === 95 === In this thesis, we study the technique for LED package, including die bond, wire bond, encapsulation, glass lens attachment and inspection. We successfully make package of two different chips, sapphire-based LED and ThinGaN LED, and compare the power efficiency.B...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56614284985152156675 |