Low Cycle Fatigue Behavior of Lead-Free Sn-Ag-Cu Solder Joint under Various Loading Modes
碩士 === 國立中央大學 === 機械工程研究所 === 95 === The purpose of this study is to investigate the LCF properties of solder joints made of a promising lead-free solder alloy, Sn-3.5Ag-0.5Cu. Displacement-controlled LCF tests were conducted on the solder joint specimens under various loading conditions, including...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79144199738548567587 |