Study of copper etching and protection
碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 95 === In this studying we can know that semi conduction production process, especially the Post Chemical mechanical Polishing (Post CMP) is very important. Post CMP caused copper wafer surface be etched. Reduction copper surface etching is our purpose. We detect c...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/28375308952883348237 |