Using BCB and LCP As New Underfill Material for High Frequency Flip Chip Interconnects

Using BCB and LCP As New Underfill Material for High Frequency Flip Chip Interconnects

碩士 === 國立交通大學 === 材料科學與工程系所 === 95 ===

Bibliographic Details
Main Author:	胡吟竹
Other Authors:	張翼
Format:	Others
Language:	en_US
Published:	2007
Online Access:	http://ndltd.ncl.edu.tw/handle/96048612107794545430

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