Using BCB and LCP As New Underfill Material for High Frequency Flip Chip Interconnects
碩士 === 國立交通大學 === 材料科學與工程系所 === 95 ===
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| Format: | Others |
| Language: | en_US |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96048612107794545430 |