Using BCB and LCP As New Underfill Material for High Frequency Flip Chip Interconnects
碩士 === 國立交通大學 === 材料科學與工程系所 === 95 ===
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| Language: | en_US |
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2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96048612107794545430 |
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ndltd-TW-095NCTU5159024 |
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ndltd-TW-095NCTU51590242015-10-13T13:59:36Z http://ndltd.ncl.edu.tw/handle/96048612107794545430 Using BCB and LCP As New Underfill Material for High Frequency Flip Chip Interconnects 使用BCB及LCP作為高頻覆晶封裝底膠填充的材料 胡吟竹 碩士 國立交通大學 材料科學與工程系所 95 張翼 2007 學位論文 ; thesis 73 en_US |
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NDLTD |
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en_US |
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Others
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NDLTD |
| description |
碩士 === 國立交通大學 === 材料科學與工程系所 === 95 ===
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| author2 |
張翼 |
| author_facet |
張翼 胡吟竹 |
| author |
胡吟竹 |
| spellingShingle |
胡吟竹 Using BCB and LCP As New Underfill Material for High Frequency Flip Chip Interconnects |
| author_sort |
胡吟竹 |
| title |
Using BCB and LCP As New Underfill Material for High Frequency Flip Chip Interconnects |
| title_short |
Using BCB and LCP As New Underfill Material for High Frequency Flip Chip Interconnects |
| title_full |
Using BCB and LCP As New Underfill Material for High Frequency Flip Chip Interconnects |
| title_fullStr |
Using BCB and LCP As New Underfill Material for High Frequency Flip Chip Interconnects |
| title_full_unstemmed |
Using BCB and LCP As New Underfill Material for High Frequency Flip Chip Interconnects |
| title_sort |
using bcb and lcp as new underfill material for high frequency flip chip interconnects |
| publishDate |
2007 |
| url |
http://ndltd.ncl.edu.tw/handle/96048612107794545430 |
| work_keys_str_mv |
AT húyínzhú usingbcbandlcpasnewunderfillmaterialforhighfrequencyflipchipinterconnects AT húyínzhú shǐyòngbcbjílcpzuòwèigāopínfùjīngfēngzhuāngdǐjiāotiánchōngdecáiliào |
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1717746126045577216 |