Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes and 3D Simulation
碩士 === 國立交通大學 === 材料科學與工程系所 === 95 === Electromigration of flip-chip solder joints has been studied extensively in recent years. Voids formed at the solder in the vicinity of the entrance point of the Al trance for solder joints with thin film UBM. However, the nucleation and propagation of the void...
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| Format: | Others |
| Language: | zh-TW |
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2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/34943534416703020213 |