Fabrication and characterization of light emitting diode package using Ultra-Small-Package substrate
碩士 === 國立成功大學 === 光電科學與工程研究所 === 95 === In the thesis, we focus on the development of substrate and compound and the characteristic of reliability in the process of LED package typed SMD. The substrate used most, in the process of LED package typed SMD, is Print Circuit Board (PCB). The thickness of...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/74759338745419027960 |