Single Mask Dual Damascene Structure Fabrication Using Partial Transmission and Exposure Technique
碩士 === 國立成功大學 === 微電子工程研究所碩博士班 === 95 === Dual damascene process has been used for copper interconnect.There are many schemes to fabricate dual damascene structure. The most common integration approaches for the dual damascene architecture are via first, trench first and buried hard mask. Which mask...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54874615984157302491 |