Effect of small amount of copper or silver doping on electromigration of eutectic SnBi solder
碩士 === 國立中興大學 === 化學工程學系所 === 95 === Due to the requirement of lead-free industry, the traditional Sn-Pb solder will soon be replaced. The eutectic Sn-58Bi solder alloy is one of the potential low melting temperature lead-free solders. The subject of this study is to investigate the electromigration...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/94030502256717277138 |