Optimization of reflow soldering process for BGA packages
碩士 === 明新科技大學 === 精密機電工程研究所 === 95 === Abstract In these years semiconductors, with its philosophy of miniaturization and sophistication, can provide powerful integrated functions with compact profiles. As package sizes reduce and the I/O channel number increases, a new semiconductor packaging...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/03275667281623801214 |