Machining characteristics of ceramics using wire saw
碩士 === 龍華科技大學 === 工程技術研究所 === 95 === Wire-saw machining is a technique that uses free abrasives to cut semiconductors, crystals, various single crystals, oxide semiconductors, as well as magnetic and ceramic materials. This study analyzes machining ceramic properties (Al2O3) using wire-saw machining...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/07789955232057523805 |