Therm-Hygro-Mechanical Analysis and Reliability Design for Finger Printer
碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 95 === The objective of this research is mainly focused on the thermo-hygro-structure coupled design and reliability analysis for finger printer. The materials involved in the structure analysis are Acrylic-based glue and low-loop gold wire. Young’s Modulus (E), tra...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93418357155515628000 |