The Study of Reflow Profile Design for The Warpage of Product and The Strength of Pb-Free Solder Ball
碩士 === 義守大學 === 電子工程學系半導體暨封裝測試產業研發碩士 === 95 === This research discussed problems occured in the reflow behavior and the package warpage . It designed different reflow temperatures with a series of Sn-Ag-Cu lead-free solder ball used by IC packaging factories . The experiment included the reflow beha...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/46565462323207314237 |