The Study of Sticking Problems of Molding Compounds In IC Encapsulation Processes

• Main Authors: Yu Jen, 陳裕仁
• Other Authors: none
• Format: Others
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/32641943702727459362

碩士 === 義守大學 === 電子工程學系半導體暨封裝測試產業研發碩士 === 95 === Epoxy Molding Compound is a common material in electronic packages. It is the encapsulation material that is generally used in the electronic encapsulation products at present, used for improving strengthening degree and steady degree of the electronic product. Under molding compound environment of the high-temperature high pressure in the mould cave, had finishing and wrapping up and covered the electronic chip, been keeping close contact with the mould surface all the time in the course taken shape, hardened, and produce the phenomenon of sticking with the contact interface of the mould, is called the mold adhesive effects. Too large an adhesion force can damage an IC and lower the yield rate. Many parameters will affect the mold adhesion force. However, there was no report showing how to measure the mold adhesion force and discussing the effect of process parameters on the mold adhesion force. As to mould, are sticking the quality that the effect will cause the products with difficult drawing of patterns and influencing the products. So how be in is it under the existing mold design prerequisite, can deal with and plate membrane not to choose by proper surface to influence, to improve the encapsulation production line and can produce effectively, it is the theme which the industrial circle and research unit pay attention to at present. This paper described the design and fabrication of an automatic EMC adhesion force test instrument that will measure adhesion force between mold surface and EMC. Several important parameters that affect the mold adhesion force in IC packaging process were also discussed in this paper. A series of experiments were done using the EMC adhesion force test instrument designed by ourselves. By using Taguchi’s method, one can determine what parameters are important for reducing the magnitude of adhesion force between EMC and mold surface.