The Study of Sticking Problems of Molding Compounds In IC Encapsulation Processes
碩士 === 義守大學 === 電子工程學系半導體暨封裝測試產業研發碩士 === 95 === Epoxy Molding Compound is a common material in electronic packages. It is the encapsulation material that is generally used in the electronic encapsulation products at present, used for improving strengthening degree and steady degree of the electronic...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/32641943702727459362 |