The wire bonding of chip Nickel Palladium bond pads
碩士 === 逢甲大學 === 材料與製造工程所 === 95 === This thesis was mainly to address gold wire bonded with different materials of wafer bond pad during assembly process .Based on advantages and disadvantages of gold wire bonded with aluminum pad which we often see, the thesis was to compare and contrast Nickel-Pal...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/09133995849855272203 |