Comparison on Creep Behaviors and Fatigue Strength Prediction of Lead-Free Solder Joint in High Density Packages
碩士 === 中原大學 === 機械工程研究所 === 95 === In the beginning, this paper compares a series of results of the literature on the subject to prove the correctness of the article, so as to ensure the credibility of this research. Then, by using finite element analysis software to simulate lead-free (95.5Sn-3.9Ag...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/06802022876083295368 |