The thermal-fluid simulation of cooling coils inchemical vapor deposition on epitaxy process
碩士 === 中原大學 === 機械工程研究所 === 95 === Abstract This study is focusing what the variation of cooling coils pipe pitch and deposit direction, which will affect the temperature distribution of the epitaxy produce zone for rotation dick type of MOCVD system, the cooling coils is at the bottom of the react...
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ndltd-TW-095CYCU54890302015-10-13T13:55:57Z http://ndltd.ncl.edu.tw/handle/19770059619460525719 The thermal-fluid simulation of cooling coils inchemical vapor deposition on epitaxy process 化學氣相磊晶(CVD)中冷卻管排之熱流模擬 Po-Jie Hwang 黃柏傑 碩士 中原大學 機械工程研究所 95 Abstract This study is focusing what the variation of cooling coils pipe pitch and deposit direction, which will affect the temperature distribution of the epitaxy produce zone for rotation dick type of MOCVD system, the cooling coils is at the bottom of the reaction chamber. In other, we also consider what the different if they has exhaust device at reaction chamber too. From the simulation results, we find the variation factors have no evidence affect. The reason for this result which maybe the reaction chamber and cooling coils temperature differential is so much. In fact, if two sides temperature differential is so much for a heat exchange system, it does not fit the heat exchange system general design rules. In other word, the heat exchange efficient or ability is not the main consider factor, so the simulation results can be accepted. The purpose of the cooling coils is maintain the uniform temperature distribution at the epitaxy produce zone, and let the chip face or thickness are very uniform and accordance. In the past, this design technique is obtained by experiences or testing methods, now they can use numerical simulation technique to approve the tried and test proceed. Especially, they can’t by the traditional design method, ex. geometrical structure or medium flow distribution. This study purpose is used the package software to do many simulation cases, and then to erect many epitaxy process technique or reference index. In addition, for the practice, the operation conditions which for chemical reaction at reaction chamber (ex. mass transfer problem), materials, and reactor exhaust velocity etc, or different produce batch, the temperature of the medium coolant should be cooperate to change. The proceed also can be used analogically this simulation model to simulate a series simulation, to erect the performance or operation diagram of reaction temperature v. s. medium coolant flow rate (or water inlet temperature) for different installations, to provide a set authority for end user or operator. This is another purpose for our study, too. Ruey-Yih Tzai 蔡瑞益 2007 學位論文 ; thesis 85 zh-TW |
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碩士 === 中原大學 === 機械工程研究所 === 95 === Abstract
This study is focusing what the variation of cooling coils pipe pitch and deposit direction, which will affect the temperature distribution of the epitaxy produce zone for rotation dick type of MOCVD system, the cooling coils is at the bottom of the reaction chamber. In other, we also consider what the different if they has exhaust device at reaction chamber too. From the simulation results, we find the variation factors have no evidence affect. The reason for this result which maybe the reaction chamber and cooling coils temperature differential is so much. In fact, if two sides temperature differential is so much for a heat exchange system, it does not fit the heat exchange system general design rules. In other word, the heat exchange efficient or ability is not the main consider factor, so the simulation results can be accepted. The purpose of the cooling coils is maintain the uniform temperature distribution at the epitaxy produce zone, and let the chip face or thickness are very uniform and accordance. In the past, this design technique is obtained by experiences or testing methods, now they can use numerical simulation technique to approve the tried and test proceed. Especially, they can’t by the traditional design method, ex. geometrical structure or medium flow distribution. This study purpose is used the package software to do many simulation cases, and then to erect many epitaxy process technique or reference index.
In addition, for the practice, the operation conditions which for chemical reaction at reaction chamber (ex. mass transfer problem), materials, and reactor exhaust velocity etc, or different produce batch, the temperature of the medium coolant should be cooperate to change. The proceed also can be used analogically this simulation model to simulate a series simulation, to erect the performance or operation diagram of reaction temperature v. s. medium coolant flow rate (or water inlet temperature) for different installations, to provide a set authority for end user or operator. This is another purpose for our study, too.
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author2 |
Ruey-Yih Tzai |
author_facet |
Ruey-Yih Tzai Po-Jie Hwang 黃柏傑 |
author |
Po-Jie Hwang 黃柏傑 |
spellingShingle |
Po-Jie Hwang 黃柏傑 The thermal-fluid simulation of cooling coils inchemical vapor deposition on epitaxy process |
author_sort |
Po-Jie Hwang |
title |
The thermal-fluid simulation of cooling coils inchemical vapor deposition on epitaxy process |
title_short |
The thermal-fluid simulation of cooling coils inchemical vapor deposition on epitaxy process |
title_full |
The thermal-fluid simulation of cooling coils inchemical vapor deposition on epitaxy process |
title_fullStr |
The thermal-fluid simulation of cooling coils inchemical vapor deposition on epitaxy process |
title_full_unstemmed |
The thermal-fluid simulation of cooling coils inchemical vapor deposition on epitaxy process |
title_sort |
thermal-fluid simulation of cooling coils inchemical vapor deposition on epitaxy process |
publishDate |
2007 |
url |
http://ndltd.ncl.edu.tw/handle/19770059619460525719 |
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