The Prediction of Etching Depth and Yield of ECR-RIE Using Neural Network

碩士 === 中原大學 === 機械工程研究所 === 95 === In this research, back-propagation neural network was applied to setting up a prediction system for Etching depth which was able to simulate electron cyclotron resonance reactive ion etching. In the semiconductor wafer fab, we received data files in the etching pro...

Full description

Bibliographic Details
Main Authors: Chi-Wei Chen, 陳起偉
Other Authors: Ming Chang
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/30700829994825425496