Research of Optimization Parameter to Copper Reduction for Printed Circuit Board

• Main Authors: Chih-Wei Cheng, 鄭至偉
• Other Authors: Heng Ma
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/02770009606705355635

碩士 === 中華大學 === 科技管理學系(所) === 95 === While producing a PCB, a layer of copper on the surface is required to etched to a specified thickness. This process is simply called copper reduction. Traditionally, we use the CuCl3 as the main component. But for the demanding for uniformity and etching velocity, we must dedicate to a more controllable medicine to use in the densely circuit fabrication of PCB, such as BGA. Recently, the CuSO4 (H2SO4/H2O2 series) medicine has been started to use in the complicated layout of IC carrier manufacturing. The advantages of this medicine include not only uniformity but also fast etching speed. Since H2SO4/H2O2 series utilized into copper reduction process has a great influence on the reliability of the PCB products, associations make every effort to optimize the process in order to operate it stable. This article discusses not only the introduction about the H2SO4/H2O2 series, but also describes the main controlling factors, copper recycling and revising, and the optimal production values about the process to contribute to PCB production. We have designed a series of experiments to get the best production values, and got some conclusions as below: First, Choosing a proper timing to sampling and analyzing the concentration of each component of the medicine, this analysis should include the parameters, copper concentration, sulfuric acid, hydrogen peroxide, temperature and etc., which control the whole etching speed of the process. Second, Base on the analysis, to replenish the sulfuric acid, hydrogen peroxide, stabilizer, pure water and the temperature adjustment. All of that above can stabilize the copper reduction efficiency. Third, the industries often use stabilizers to improve the copper reduction property. So, the choice of a proper stabilizer will make a progress on the process. Fourth, in the conclusions of this article, we find the H2SO4/H2O2 series would be more suitable for the IC carrier industries and MMC products. If only the machinist can carefully monitor the process values of each parameter, then the properties of the products can be controlled.