Research of Optimization Parameter to Copper Reduction for Printed Circuit Board
碩士 === 中華大學 === 科技管理學系(所) === 95 === While producing a PCB, a layer of copper on the surface is required to etched to a specified thickness. This process is simply called copper reduction. Traditionally, we use the CuCl3 as the main component. But for the demanding for uniformity and etching velocit...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/02770009606705355635 |