Thermal Resistances Analyses and Measurements of High-power LED Packages and Their Modules
碩士 === 長庚大學 === 機械工程研究所 === 95 === Abstract The purpose of this study is to investigate the thermal behaviors of high-power LED packages and their modules. The junction temperatures (Tj ) of three kinds of LEDs (including COP, Cree, and Lumiled) were measured by LED Junction Temperature Tester. Furt...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/29446078730783275556 |