The Effects of EMC's Mechanical Properties and Residual Strains on Warpages of PBGA Packages
碩士 === 長庚大學 === 機械工程研究所 === 95 === The first purpose of this study is to quantify the residual strains of the EMC in the PBGA package during the manufacturing and IR reflow processes by combining experimental, theoretical and numerical approaches. In the experiments, a full-field shadow moiré with s...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65581731190825093149 |