Solid Liquid Interdiffusion Bonding of Aluminum –Copper–Magnesium Systems
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 94 === Aluminum and copper have been widely used in many heat sink modules due to their high thermal conductivities. Conventionally, aluminum and copper were bonded by using thread or fixture fastened. However, for the consideration of bonding strengths and thermal c...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/09536067659969941111 |