Thermal Fatigue Analysis for Solder Joints of CSP and BGA Packages
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 94 === The trend of electronic package is toward higher power, lighter, thinner, shorter, and smaller. The accumulated heat is the cause of electrical failure. The solder ball induces thermal strain under thermal loading due to the thermal expansion mismatch between...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06458290286232081529 |