Effects of Thiourea on Electroless Copper Deposition
碩士 === 國立臺北科技大學 === 化學工程所 === 94 === The emergence of copper manufacturing process has come about because of the existent bottleneck of the aluminum material used for the conducting wires on semiconductor chips. As the manufacturing processes reduce the component size in ICs to less than 0.25 mm, th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/xc7937 |