Effects of additives and chelating agents on electroplating and etching of copper for electronic packaging.
碩士 === 國立聯合大學 === 化學工程學系碩士班 === 94 === The reaction mechanism and characterization of Cu micro-plating films with thickness of about 18 μm were studied by using different organic additives and chelating agents. The effects of electroplating process were analyzed using the linear voltammetric scannin...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/50666475796614573559 |