Effects of additives and chelating agents on electroplating and etching of copper for electronic packaging.

• Main Authors: Ting-Ying Ho, 何定穎
• Other Authors: none
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/50666475796614573559

碩士 === 國立聯合大學 === 化學工程學系碩士班 === 94 === The reaction mechanism and characterization of Cu micro-plating films with thickness of about 18 μm were studied by using different organic additives and chelating agents. The effects of electroplating process were analyzed using the linear voltammetric scanning method. The characteristics of micro-plating samples were investigated by scanning electron microscopy, surface profilometer and four-point probe measurements. The results for the commerce recipe of OKUNO showed that the sample film which possess good efficiency of plating has a uniform densify structure. The plating reaction process and films characterization was affected by the plating recipe and the change of initial voltage of deposition copper even were occurred. The results of sample of studied plating recipe were similar the sample of commerce recipe. Copper thin films were deposited by sputtering on silicon wafer substrates. The dissolution of oxidized copper in dilution acid solution at different reaction temperature was studied. The samples were analyzed by profilometer, atomic force microscopy, optical microscopy and four-point probe measurements. The results showed that the dissolution reaction kinetics of oxidized copper was produced by two step behavior in dilute H2SO4 solution. The different thinkness of oxided layer was diluted by different acid solutions. It is shown that the morphology and resistivity of various oxidized films was affected by the acid solution and dissolution reaction temperature.