Wire Permutation and Spacing for Low Power Fault-Tolerant Bus

碩士 === 國立臺灣科技大學 === 電子工程系 === 93 === As technology scales to the very deep submicron (VDSM) dimensions, the coupling capacitances between adjacent bus wire grow rapidly, and have a significant impact on power consumption and signal integrity issue of whole chip. Thus, it is important to design fault...

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Bibliographic Details
Main Authors: Cheng-Liang Hsu, 許正良
Other Authors: Shanq-Jang Ruan
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/84296012282043985278