Characterization of Mechanical Properties of Electroplated Nickel Film and Ni3Sn4 Intermetallic Compound
碩士 === 國立臺灣大學 === 應用力學研究所 === 94 === With the improvement of filpchip technique and chip efficiency, temperature problem is becoming an important issue. When chip is working, the high temperature easily causes the packaging to deform because chip and substrate have different thermal expansion coeffi...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/02547359579143905506 |