quantitative reliability analysis of drop impact testing for electronic packages
碩士 === 國立臺灣大學 === 機械工程學研究所 === 94 === From reliability engineering point of view, present study investigates the effect of solder ball size and parametical values of life prediction model on the impact life of electronic packages. First, finite element analysis is employed to find the maximum stress...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72742290118039048525 |