Fabrication of Thermopile on Flexible Substrate
碩士 === 國立清華大學 === 電子工程研究所 === 94 === This paper is to fabricate a three-dimensional(3D) thermopile with 64 in-series thermocouple coated on polyimide(PI) substrate. By using wet-etching technology to etch through PI with thickness 25μm, the cold and hot junction of thermocouple are then located at t...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/21531594063410601460 |