A Study of the Impact of Molding Parameters and Compound Materials on Gate Remaining in IC Packaging Process

• Main Authors: Te-Tai Lu, 呂德泰
• Other Authors: Ming-Shyan Huang
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/90804759829490473943

碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 94 === ABSTRACT New IC package packing method is improving day after day due to IC package tends to be higher and higher pin count, thinner and thinner in size. If there happens to be a product out of quality control in the continuously packing process, not only this product needs to be scrapped, but also it will influence the yield in the coming stages. Therefore, improving the yield rate and reducing the impact to the following stages are the first priority in industry. DIP, SOP and QFP etc. are sorted as tradition package in industry. Among them, product as QFP gets severest problem in gate remain and deepest influence to coming stages. This thesis took QFP for research topic and simulated the experiment by using actual packing process in industry. First focus was on parameters setting such as temperature, pressure, and preheating time. Design of Experiment was applied to find out optimum parameters setting. Further investigation focused on the impact of fluidity, while epoxy material transferring, on the gate size. Such as whether changes de-gating angle and depth will influence the gate remain to find out better de-gating method. According to the experiment result, the dimensions of gate size and de-gate apparatus are the major influence on finished goods.