A Study of the Impact of Molding Parameters and Compound Materials on Gate Remaining in IC Packaging Process
碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 94 === ABSTRACT New IC package packing method is improving day after day due to IC package tends to be higher and higher pin count, thinner and thinner in size. If there happens to be a product out of quality control in the continuously packing process, not only t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90804759829490473943 |