Aging Effect on the Long-Term Mechanical Properties of Sn-3.5Ag Lead-Free solder
碩士 === 國立中央大學 === 機械工程研究所 === 94 === ABSTRACT The purpose of this study is to investigate the mechanical properties and creep behavior of extruded Sn-3.5Ag lead-free solder at differently aged conditions. Various aging treatments could cause changes in microstructure and mechanical properties. Fr...
Main Authors: | Po-Ching Li, 李柏慶 |
---|---|
Other Authors: | Chig-Kuang Lin |
Format: | Others |
Language: | en_US |
Published: |
2006
|
Online Access: | http://ndltd.ncl.edu.tw/handle/7umxaj |
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