Aging Effect on the Long-Term Mechanical Properties of Sn-3.5Ag Lead-Free solder

碩士 === 國立中央大學 === 機械工程研究所 === 94 === ABSTRACT The purpose of this study is to investigate the mechanical properties and creep behavior of extruded Sn-3.5Ag lead-free solder at differently aged conditions. Various aging treatments could cause changes in microstructure and mechanical properties. Fr...

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Bibliographic Details
Main Authors: Po-Ching Li, 李柏慶
Other Authors: Chig-Kuang Lin
Format: Others
Language:en_US
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/7umxaj