Copper Electroplating and Electropolishing for the Application of Cu Damascene Interconnects
博士 === 國立交通大學 === 材料科學與工程系所 === 94 === There are three parts in this study. The first introduces aging influence of polyethylene glycol (PEG) and PEG- bis-3-sodiumsulfopropyl disulfide (SPS) containing bath on gaps filling during Cu electrodeposition. The second part introduces the role of alcohols...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18915190632133973500 |