Au-Free Fully Cu-Metallized InGaP/GaAs HBTs Using Pd/Ge/Cu Ohmic Contact to N-type GaAs

碩士 === 國立交通大學 === 材料科學與工程系所 === 94 === In this study, a low contact resistivity Pd/Ge/Cu ohmic contact to n-type GaAs has been successfully developed. The Au-free fully Cu-metallized InGaP/GaAs HBTs using Pd/Ge/Cu ohmic contact to n-type GaAs also has been successfully fabricated for the first time....

Full description

Bibliographic Details
Main Authors: Chia-Ching Lin, 林家慶
Other Authors: Edward Yi Chang
Format: Others
Language:en_US
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/27606966960858836731