A Study of Fluxless Reflow Soldering of Eutectic Solder Ball Using Pulse YAG Laser

碩士 === 國立交通大學 === 材料科學與工程系所 === 94 === This work studied the fluxless reflow soldering of eutectic solder ball on copper (Cu) pad utilizing pulse YAG laser. The effects of soldering conditions including laser power density, pulse width (i.e., the irradiation time) and reflow times on the morphology,...

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Bibliographic Details
Main Authors: Yi-Jing Chen, 陳怡靜
Other Authors: T.-E. Hsieh
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/87662687688017552565